Inspection & Test Process
We deliver comprehensive and reliable inspection services tailored to meet the diverse needs of our clients. Understanding our capabilities and the distinct categories of inspections we offer will help you make informed decisions to ensure the quality, safety, and efficiency of your operations.
Service Highlights
Experienced Professionals
Our team consists of certified and highly trained inspectors with expertise in multiple inspection methodologies and industry standards.
Advanced Technology
We utilize the latest inspection tools and technologies to ensure precise and accurate assessments.
Comprehensive Reporting
Detailed and actionable reports are provided, highlighting findings and compliance status to help you address any issues effectively.
Customized Solutions
We understand that each client and project is unique. Our services are tailored to meet specific requirements, ensuring that all material is tested to specifications.
DCI Testing & Inspection Processes
Testing is performed on random samples using the DCI Sample Plan, free of charge as a value-added service. This standard inspection is based on risk and includes the following methods if capable and as applicable:
- External Visual Inspection
- Dimensional Check
- Device Surface Test (Acetone)
- Electrical Testing
- Programming/Memory Testing*
- Radiological (X-Ray) Inspection
- Delid/Decapsulation Internal Analysis*
*Based on part and/or socket availability
In addition to our standard inspection, we offer an enhanced version of testing based on capabilities and applicability. Enhanced testing includes:
- Increased Sample Size
- XRF (X-ray Fluorescence) Analysis
- Solderability Testing (Non-BGA component only)*
- Multiple Decapsulations*
If requested:
- Mechanical Scrape Test*
- Device Marking Test (mineral spirits and isopropyl alcohol)
*Based on part and/or socket availability
AS6081 certified orders undergo our standard inspection as well as third-party AS6081 inspection and testing. By default, unless otherwise advised, a quote will be provided for the minimum tests as well as Optional Test C and Baking (if parts are MSL 3+). We partner with ISO/IEC 17025 accredited laboratories to perform testing per AS6081 or AS6171 standards. A detailed third-party test report will be provided for approval prior to shipping.
AS6081 Required Testing
AS6081 mandates the following minimum tests from Table 1 in the standard:
-Active Parts: A1-A6
-Passive Parts: A1-A3
- A1: Documentation and Packaging Inspection
- A2: External Visual Inspection
- A3: Remarking & Resurfacing
- A4: Radiological X-Ray Inspection
- A5: XRF
- A6: Delid/Decapsulation (3 Devices)
Additional Tests Available on Request
Additional counterfeit mitigation testing can be requested, including:
- A3 Option: Scanning Electron Microscopy (SEM)
- A3 Option: Quantitative Surface Analysis
- B: Thermal Testing
- C: Electrical
- D: Burn-In
- E: Hermeticity Verification
- F: Scanning Acoustic Microscopy (SAM)
- G: Other specified tests
Inspection & Testing Information Chart
Test Name
Test Type
Description
External Visual Inspection
Non-Destructive
A thorough examination of the external components and surfaces to identify visible defects, scratches, corrosion, or assembly issues.
Dimensional Check
Non-Destructive
Measurement of components and assemblies to ensure they meet specified dimensions and tolerances using precision instruments.
Device Surface Test (Acetone)
Non-Destructive
Assessment of device surface integrity by applying acetone to detect flaws, residues, or contamination that may affect performance.
Electrical Testing
Non-Destructive
Evaluation of electrical properties, including continuity, resistance, and signal integrity to ensure proper operation of circuits.
Programming/Memory Testing
Non-Destructive
Verification of device programming and memory functionality to ensure data integrity and correct performance under various conditions based on the availability of the socket.
Radiological (X-Ray) Inspection
Non-Destructive
Use of X-ray imaging to inspect internal structures, solder joints, and component placement without disassembling the device.
Delid/Decapsulation Internal Analysis
Destructive
Removal of device packaging to access and analyze internal components and structures for defects or compliance using specialized techniques.
XRF (X-Ray Fluorescence) Analysis
Non-Destructive
Testing method to determine the elemental composition of materials by measuring fluorescent X-rays emitted from the sample.
Solderability Testing
(Non-BGA Components Only)
Destructive
Assessment of a componentâs ability to form reliable solder joints, ensuring proper electrical and mechanical connections during assembly.
Mechanical Scrape Test
Destructive
Evaluation of surface adhesion and durability by mechanically scraping the surface and assessing the extent of material removal or damage.
Device Marking Test (Mineral Spirits and Isopropyl Alcohol)
Non-Destructive
A thorough examination of the external components and surfaces to identify visible defects, scratches, corrosion, or assembly issues.
